- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/34 - Arrangements for cooling, heating, ventilating or temperature compensation
Patent holdings for IPC class H01L 23/34
Total number of patents in this class: 3446
10-year publication summary
297
|
226
|
237
|
231
|
250
|
247
|
167
|
128
|
132
|
36
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
146 |
Intel Corporation | 45621 |
135 |
Samsung Electronics Co., Ltd. | 131630 |
124 |
International Business Machines Corporation | 60644 |
96 |
Infineon Technologies AG | 8189 |
92 |
Mitsubishi Electric Corporation | 43934 |
84 |
Texas Instruments Incorporated | 19376 |
64 |
Denso Corporation | 23338 |
64 |
Micron Technology, Inc. | 24960 |
59 |
Fuji Electric Co., Ltd. | 4750 |
59 |
STATS ChipPAC Pte. Lte. | 1516 |
54 |
Semiconductor Components Industries, L.L.C. | 5345 |
39 |
Rohm Co., Ltd. | 5843 |
36 |
Murata Manufacturing Co., Ltd. | 22355 |
32 |
Monolithic 3D Inc. | 270 |
32 |
Huawei Technologies Co., Ltd. | 100781 |
28 |
Advanced Semiconductor Engineering, Inc. | 1546 |
28 |
Qualcomm Incorporated | 76576 |
26 |
Toyota Motor Corporation | 28582 |
25 |
Renesas Electronics Corporation | 6305 |
25 |
Other owners | 2198 |